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Industry Insight: Global 2.5D Packaging Capacity Shortage to See Modest Relief by 2027
4 hour ago /
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Author：小编
According to TrendForce's latest research on the wafer foundry sector, the surge in AI-related demand since 2023 has resulted in a severe capacity crunch for 3nm to 2nm wafers, as well as 2.5D/3D packaging solutions. Notably, the persistent scarcity of CoWoS (Chip-on-Wafer-on-Substrate) packaging has caused bottlenecks in the supply chain for essential production equipment, packaging substrates, and critical raw materials. The front-end 3nm manufacturing process, which is exclusively provided by TSMC, faces particularly acute capacity constraints, making it a highly competitive area among technology firms.
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