Huanjingxin Technology has recently successfully closed an angel round of financing, raising tens of millions of yuan. This round was spearheaded by Qifu Capital, with Shengshi Investment, Haiyi Investment, and the Hunan Provincial College Students' Venture Capital Fund joining as co-investors. The proceeds from this financing will be earmarked for several key areas: the establishment of Wuxi's inaugural mass production line, investments in research and development (R&D), and bolstering working capital reserves.

Established in May 2025, Huanjingxin Technology stands out as the pioneer in China to introduce a non-destructive recovery and reuse solution tailored for temporary bonding substrates. Leveraging its cutting-edge technology, the company facilitates the infinite recycling of substrates, thereby driving down the costs associated with advanced packaging. Presently, Huanjingxin Technology has successfully navigated technical verification by a premier domestic packaging enterprise and is actively engaged in discussions with multiple top-tier packaging and testing manufacturers.

The initial phase of the production line, situated in Wuxi, is engineered to accommodate a monthly throughput of 25,000 wafers. The construction of this facility is on track for completion within this month, after which it will embark on customer factory validation and onboarding procedures.