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The research team, consisting of Wang Wei and Zhang Chi from the School of Integrated Circuits at Peking University, the National Key Laboratory of Micronano Fabrication Technology, and the Advanced I
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Author：小编
As the power density of high-performance computing chips keeps escalating, managing heat at the chip level has emerged as a pivotal concern that directly impacts the performance and reliability of electronic systems. Two-phase cooling, a technique that leverages the latent heat generated during phase changes to facilitate efficient heat transfer, is widely regarded as a crucial solution to tackle the heat dissipation challenges encountered in electronic devices with high heat fluxes.
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