On April 21, 2026, Dike Industrial (300842.SZ) unveiled a strategic plan to issue A-share stocks to a targeted group of investors, with the objective of raising a maximum of RMB 3 billion. The issuance will involve no more than 35 recipients. Following the deduction of issuance expenses, the proceeds will be allocated to several key projects, including the Annual Production of 2,000 Tons of Base Metal Low-Silver Photovoltaic Paste initiative, the 1450t/a Electronic-Grade Metal Powder Capacity Expansion and Upgrade endeavor, the Next-Generation High-Efficiency Photovoltaic Cell Metallization Paste R&D effort, the Storage Chip Packaging and Testing Base Project, and the Semiconductor Packaging R&D Center Project. Additionally, a portion of the funds will be utilized to repay bank loans and bolster working capital.

The issue price will be set at no less than 80% of the average trading price of the company's shares over the 20 trading days preceding the pricing benchmark date. Furthermore, the total number of shares issued will not exceed 30% of the company's total share capital prior to the issuance. Implementation of this share issuance is contingent upon approval from the company's shareholders' meeting, review by the Shenzhen Stock Exchange, and registration with the China Securities Regulatory Commission.