Yesterday, TSMC held its institutional investor briefing to discuss the financial report for the first quarter of 2026. Chairman C.C. Wei revealed that TSMC has deviated from its historical pattern in the realm of 3nm process technology. The company is proactively investing in new production capacities, even after having already met its preset targets, all in an effort to satisfy customer demand.
In Tainan Science Park, TSMC is constructing a brand-new 3nm wafer fab. Mass production at this facility is anticipated to kick off in the first half of 2027. Over in the United States, TSMC Arizona Fab 2 is projected to start mass production in the latter half of 2027. Additionally, JASM Fab 2 in Japan has a scheduled mass production timeline set for 2028.
In parallel with these new projects, TSMC is also focusing on optimizing its existing operations. The company is upgrading its current 5nm production lines in Tainan to the 3nm standard and further boosting capacity by enhancing operational efficiency.