On April 16, 2026, FAW Research & Development Institute, in collaboration with industry partners, successfully developed China's first automotive-grade advanced-process multi-domain integration chip, the 'Hongqi 1'. This chip integrates five major functional domains: driving assistance, intelligent cockpit, vehicle body control, communication, and security, achieving integrated 'cockpit, driving, and control' functionality. Its logical computing and image processing capabilities are improved by 21.7% and 15.4%, respectively, compared to mainstream chips in the industry. It supports complex cockpit scenarios and reserves computational redundancy for the future integration of intelligent cockpits and autonomous driving. The chip features a built-in independent security island, meeting the highest safety and information security requirements, ensuring stable critical control under extreme failure conditions. Through multi-domain integration, it reduces the number of electronic control units and wiring harness complexity in the entire vehicle, lowers system costs and development cycles, enhances supply chain autonomy and controllability, and reduces reliance on imported chips.