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TSMC recently convened a financial results briefing for the first quarter of 2026, during which it detailed its strategic roadmap for pioneering advanced process technologies at the 1nm node and beyond. The company has outlined plans to construct the A10 wafer fabrication plant within the Tainan Science Park, specifically designating the P1 to P4 sites for the research and development of cutting-edge processes at 1nm and below. Trial production at this facility is slated to begin in 2029, with an initial projected monthly output of around 5,000 wafers. In parallel, TSMC will advance its 2nm process development at the P1 to P2 sites in Hsinchu Baoshan. Meanwhile, the P3 site will concentrate on refining both the 2nm and A14 processes, with completion anticipated by mid-year.
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