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Samsung Electro-Mechanics to Supply FC-BGA Packaging Substrates for NVIDIA’s Groq3 AI Chip
17 hour ago /
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Author：小编
According to reports from South Korean media, Samsung Electro-Mechanics has secured its position as a primary (Tier 1) supplier of Flip Chip Ball Grid Array (FC-BGA) substrates for NVIDIA’s Groq3 Language Processing Unit (LPU)—a dedicated AI inference chip. Mass production is anticipated to kick off as early as the second quarter of this year. The Groq3 LPU, designed as an inference accelerator for NVIDIA’s next-generation AI semiconductor platform, Vera Rubin, will be fabricated by Samsung Electronics utilizing a cutting-edge 4-nanometer process for wafer foundry services.
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