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SEMICON China 2026 | YTC Tech's Panel-Level High-Density System Packaging & Testing Solutions Propel AI Computing Advancement
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Author：小编
On March 25, SEMICON China 2026 commenced at the Shanghai New International Expo Centre. YTC Tech took center stage by presenting its cutting-edge panel-level high-density system packaging and testing solutions. The company emphasized how FOPLP (Fan-Out Panel-Level Packaging) technology can facilitate the heterogeneous integration of AI chips, leveraging larger-sized, higher-efficiency high-density interconnects to significantly boost their performance.
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