Search
On Tuesday, March 24 (local time), chip design giant Broadcom announced that it is encountering supply chain limitations, primarily due to the fact that the production capacity of its key chip manufacturing partner, TSMC, has hit a critical threshold. This development underscores the far-reaching impact of the AI boom on the technology sector. On the same day, the Director of Product Marketing for Broadcom's Physical Layer Products Division revealed to the media that TSMC is currently grappling with capacity constraints. Despite plans to continue expanding its production capabilities until 2027, TSMC anticipates that capacity issues will emerge as a significant bottleneck in 2026, with potential repercussions throughout the entire supply chain.
-
C114 Communication Network -
Communication Home
