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Recently, Malaysian Prime Minister Anwar Ibrahim announced that Intel's advanced packaging plant in Malaysia, codenamed 'Project Pelican,' will be fully operational by late 2026. Construction of the plant will enter its final phase by the end of 2025, with an overall completion rate of 99%. Intel has added an additional $200 million investment to ensure its successful completion. The plant will undertake key processes such as chip wafer sorting and preprocessing, supporting two advanced packaging technologies: EMIB and Foveros. Intel plans to upgrade the package size from 100x100 mm to 120x120 mm, increase the number of HBM stacks from 8 to 12 layers, and aims to introduce an ultra-large 120x180 mm package by 2028, supporting 24 layers of HBM stacking.
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