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Samsung Electronics: Shipments to be Dominated by HBM4 in 2026, HBM5 to Adopt 2nm Process
3 day ago /
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Author：小编
According to South Korean media reports, Samsung Electronics is accelerating the layout of next-generation high-bandwidth memory. HBM4 has officially entered mass production this year, and Samsung has already set its sights on even more advanced products, planning to upgrade the base wafer process of HBM5 from 4nm to 2nm and adopt 1d DRAM as the core stacked memory for HBM5E.
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