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A seminar focused on chip design tailored for OpenClaw applications is scheduled to occur from 1:30 PM to 5:30 PM on March 21, 2026. The venue for this event is the first floor of Building D, located within the Beijing Integrated Circuit Industry-Education Integration Base in the Beijing Economic-Technological Development Area. This seminar is jointly organized by the Zhongguancun High-Performance Chip Interconnection Technology Alliance and several other esteemed organizations, with Beijing Qingyun Technology Co., Ltd. serving as a key collaborator. The primary objective of this gathering is to bring together leading experts from the industry and foster a robust platform that facilitates the seamless integration of AI Agents with the chip sector, promoting innovation and advancement in this cutting-edge field.
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