Search
Ming-Chi Kuo: NVIDIA’s Next-Gen Rubin Platform Begins Testing of Innovative Materials, Signaling the Dawn of a New PCB Upgrade Cycle
8 hour ago /
Read about 0 minute
Author：小编
Based on the latest supply chain research findings released on March 13 by Ming-Chi Kuo, an analyst at TF International Securities, NVIDIA has embarked on testing the next-generation copper-clad laminate material, M10, in collaboration with PCB manufacturers. This cutting-edge material is earmarked for use in the orthogonal backplanes and switch blade motherboards of the Rubin Ultra and Feynman platforms. Should the testing proceed without a hitch, the M10 material and corresponding PCBs are poised to enter mass production in the latter half of 2027. This development is anticipated to trigger a fresh wave of extensive procurement of AI server PCB materials, offering a significant boost to the performance of relevant supply chain vendors.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
