On March 12, Guangli Technology announced during an investor relations event that its domestically manufactured semiconductor mechanical dicing equipment has been operating at full production capacity since July 2025. Not only have shipments continued to rise, but new orders have also been steadily increasing. To capitalize on industry opportunities, the company is ramping up its production capabilities and fully advancing the construction of the second-phase project at its airport industrial park site. The new facility is expected to commence operations in the first quarter of 2027, with production capacity expected to more than triple its current level.
