Recently, the 73rd International Solid-State Circuits Conference (ISSCC) 2026, often hailed as the "International Olympics of Chip Design," took place in San Francisco, USA. This conference stands as a premier and highly influential international academic gathering in the realm of integrated circuits.
According to the statistics based on primary affiliation at this year's conference, Peking University emerged as a standout performer, with six high-caliber papers being selected for presentation. A delegation comprising faculty members and students from the School of Integrated Circuits at Peking University made the journey to the United States to participate in this prestigious event.
During the conference, they not only showcased the latest research advancements across multiple directions but also engaged in profound academic exchanges and collaborations with their international counterparts, fostering a spirit of innovation and cooperation in the global integrated circuits community.