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Six Remarkable Chip Design Accomplishments by the University of Science and Technology of China Showcased at ISSCC 2026
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Author：小编
Recently, at the IEEE International Solid-State Circuits Conference (ISSCC) — a leading event in the realm of integrated circuit design — six chips, crafted by the research teams of Professor Cheng Lin and Professor Hu Yizhe from the School of Microelectronics at the University of Science and Technology of China, were proudly presented. This showcase underscores the school's robust prowess and unwavering commitment to innovation in integrated circuit design. Renowned as the "Chip Olympics," ISSCC enjoys widespread acclaim from both academic and industrial circles globally as the pinnacle conference for integrated circuit design. It is noteworthy that ISSCC 2026 took place in San Francisco, USA, spanning from February 15 to 19.
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