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ACM Research Shanghai Secures Advanced Packaging Equipment Orders from Multiple Global Customers
1 day ago /
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Author：小编
ACM Research Shanghai has successfully secured orders for advanced packaging equipment from several leading global semiconductor and technology companies. This includes multiple wafer-level advanced packaging plating and wet processing equipment from a globally leading packaging and testing service company in Singapore, as well as a panel-level advanced packaging vacuum cleaning equipment from a global leading semiconductor packaging manufacturer outside mainland China. These equipment are scheduled for delivery in the first quarter of 2026. Additionally, multiple wafer-level advanced packaging wet processing equipment from a leading technology company in North America are expected to be delivered later this year.
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