On February 26, SK Hynix revealed that, on the 25th (local time), it co-hosted the ‘Launch Event for the HBF Specification Standardization Alliance’ with SanDisk at SanDisk’s headquarters in California, USA. During this event, the two companies officially unveiled their global standardization strategy for HBF (High Bandwidth Flash), a next-generation memory solution specifically designed for the AI inference era.

Positioned between HBM (High Bandwidth Memory) and SSD (Solid State Drive), HBF is engineered to address the growing need for high bandwidth, large storage capacity, and superior energy efficiency in AI inference applications. By overcoming the limitations of traditional memory architectures, HBF aims to reduce the total cost of ownership (TCO) for AI systems. Industry experts predict that the market for this technology will experience significant growth around 2030.