On February 12, Samsung Electronics made a groundbreaking announcement, revealing that it had initiated shipments of the world's inaugural mass-produced batch of HBM4 products. These cutting-edge products harness the power of the 1c DRAM process alongside a 4nm logic substrate, ensuring not only stable yields but also industry-leading performance, all without necessitating any supplementary design modifications. Their data processing prowess is remarkable, boasting a speed of 11.7Gbps and the potential to soar up to 13Gbps. The aggregate bandwidth per stack can skyrocket to an impressive 3.3TB/s, marking a staggering 2.7-fold surge compared to the preceding generation. Additionally, these products boast a 40% enhancement in power efficiency and a 30% improvement in heat dissipation capabilities. Samsung projects that its HBM sales will experience a more than threefold surge in 2026 when juxtaposed with 2025, and it is currently in the process of augmenting its HBM4 production capacity to meet the burgeoning demand.