On February 12, Pyris Electronics issued a notice revealing that on February 11, 2026, the company entered into a [Here, the original text seems to be missing the term for the agreement, such as "cooperation agreement"] with a university. The collaboration aims to foster all-around cooperation in the realm of high-capacity power semiconductor devices and their corresponding power electronic modules. This partnership will encompass various aspects, including design, simulation analysis, experimental validation, product finalization, drive development, as well as production and marketing promotion.

In this joint endeavor, Pyris Electronics will take charge of chip design, manufacturing, packaging, and testing. Meanwhile, the university will spearhead the application verification process. The agreement will become effective upon being signed and stamped by representatives from both sides and will remain in force for a duration of three years. As there is no specific financial commitment involved, it is anticipated that this partnership will not have a substantial impact on the company's operating performance in the current year.