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Changxin to Dedicate 20% of Production Capacity to HBM3 Mass Production Next Year
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Author：小编
ChangXin Memory Technologies, a Chinese memory chip manufacturer, has embarked on the mass production of HBM3 high-bandwidth memory modules. The company intends to manufacture HBM3 using roughly 60,000 wafers monthly, which will constitute 20% of its overall production capacity. Earlier, South Korean firms had already launched full-scale mass production of fourth-generation high-bandwidth memory products in 2023, prompting ChangXin Memory Technologies to make concerted efforts to keep pace with international mainstream manufacturers. At present, ChangXin Memory Technologies has supplied HBM3 samples to prominent domestic customers and aims to initiate full-scale mass production from 2026 onwards.
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