According to data sourced from Tianyancha, Xi'an ESWIN Materials Technology Co., Ltd., in collaboration with Xi'an ESWIN Silicon Wafer Technology Co., Ltd., filed a patent application for an invention titled 'Silicon Wafer Fixing Device and Silicon Wafer Etching Equipment' on December 6, 2024. The patent, bearing the authorization announcement number CN119673859B, was officially granted on October 17, 2025. This innovative patent introduces a cutting-edge silicon wafer fixing device along with silicon wafer etching equipment. The system comprises a lower supporting platform, an upper pressing platform, and multiple pressing discs. This design is capable of accommodating silicon wafers of various sizes and meeting diverse edge etching requirements. Moreover, it effectively prevents chipping during the process and significantly enhances etching precision, marking a notable advancement in the field.