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Topping-Out Ceremony Held for Silan Microelectronics Headquarters' R&D, Testing, and Production Base Project
2 week ago /
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Author：小编
On January 28, 2026, the R&D, Testing, and Production Base Project for Silan Microelectronics' Headquarters achieved a significant milestone—the topping-out ceremony—in Binjiang District, Hangzhou. Spanning a total construction area of 96,000 square meters, this project is poised to become a premier hub for chip R&D and testing. It will play a pivotal role in fueling the swift advancement of power semiconductors and other related fields.
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