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Blue Arrow Electronics: Advanced Packaging Tech Not Yet Directly Utilized for AI & High-Performance Computing Chip Packaging
2 week ago /
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Author：小编
On January 29, 2026, Blue Arrow Electronics clarified on an interactive platform that, to date, its advanced packaging technology hasn't been directly employed in the packaging of AI chips and high-performance computing chips. Nevertheless, its power devices and related products have found direct or indirect applications in AI servers and associated areas. At present, the company's advanced packaging technology is primarily focused on supporting chips, like power and power management chips, and hasn't entered the packaging phase (here, 'packaging phase' refers to the specific stage or process of packaging) of AI chips and computing chips.
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