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The research team led by Professor Duan Guotao from the School of Integrated Circuits at Huazhong University of Science and Technology has made new progress in the field of wafer-level manufacturing o
2 week ago /
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Author：小编
With the development of the 'More than Moore' paradigm, microelectromechanical systems (MEMS) have emerged as a core technology for next-generation intelligent sensing applications. However, reliably integrating high-performance nanomaterials into three-dimensional suspended MEMS architectures and achieving wafer-level compatible manufacturing has long been a persistent challenge in the development of high-performance MEMS gas sensing chips.
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