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TSMC is set to dramatically ramp up its CoWoS advanced packaging capacity in the upcoming two - year period. This move is aimed at addressing the soaring demand for AI chips from major clients like NVIDIA and Google. NVIDIA has emerged as TSMC's top CoWoS customer. Meanwhile, ASIC chip customers, exemplified by Google, are constantly placing urgent orders in a bid to secure sufficient capacity.
In light of this situation, TSMC has revised its CoWoS capacity targets for the 2026 - 2027 timeframe and is in the process of re - evaluating its expansion strategy. At the AP8 factory site within the Southern Taiwan Science Park, a brand - new P2 plant will be constructed, with its primary focus on CoWoS production. Additionally, the SoIC production line at Chiayi's AP7 will undergo a conversion to be dedicated to CoWoS operations.
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