Our reporters have learned from Fudan University that the research team led by Peng Huisheng and Chen Peining at the university has brought the concept of "fiber chips" to life. They achieved this by devising a multi-layer spiral stacking architecture, which enabled the large-scale integrated circuit fabrication within polymer fibers. This groundbreaking accomplishment was featured in the journal Nature on January 22, marking a historic moment as chips make the transition from rigid, bulky forms to soft, fiber-based ones.

Research indicates that these "fiber chips" boast information processing capabilities on par with those of typical commercial chips. What sets them apart is their remarkable flexibility, allowing them to adapt seamlessly to complex deformations, including stretching and twisting. Moreover, their weavability opens up new possibilities. These chips are poised to offer vital technological support for burgeoning industries such as brain-computer interfaces, electronic textiles, and virtual reality.