Data sourced from Wind Information reveals that, starting from January 2026, four companies within the semiconductor industry chain—namely Shanghai Biren Technology Co., Ltd., Shanghai Tianshu Zhixin Semiconductor Co., Ltd., OmniVision Integrated Circuit (Group) Co., Ltd., and GigaDevice Semiconductor Inc.—have successfully completed their Initial Public Offerings (IPOs) on the Hong Kong Stock Exchange (HKEX). Furthermore, over 40 semiconductor enterprises, including Xintianxia Technology Co., Ltd., are expediting their efforts to list on the HKEX. These companies span the entire semiconductor industry chain, encompassing AI chips, memory storage, packaging and testing services, as well as equipment manufacturing. This emerging trend underscores the robust financing and growth requirements of semiconductor firms. Simultaneously, it signifies a heightened level of confidence and endorsement from the capital market towards the domestic semiconductor sector.