At present, the packaging industry is poised to enter a fresh cycle of price increases. Fueled by domestic computing power needs, the advanced packaging market has drawn increased focus. Investors are recommended to focus on the areas of advanced packaging and memory packaging. The packaging segment has been somewhat lagging within the semiconductor industry, yet recent underlying conditions have exhibited slight enhancements: In the realm of 2.5D CoWoS advanced packaging, JCET's (Shenghe Jingwei) IPO application has been approved for processing, TSMC's advanced packaging capacity is operating at full throttle, and the expansion of domestic advanced process capacity has spurred demand growth. Due to upstream influences, the packaging and testing sector may commence a new round of price hikes, with prices for memory packaging and testing already on an upward trajectory. Looking ahead, the CPO-related packaging field also merits attention. It's important to acknowledge that risks like sluggish industry growth and heightened competition still persist. The information in this article is solely for reference and does not serve as investment advice.