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During a recent institutional research session, Biwin Storage disclosed that its wafer-level advanced packaging and testing manufacturing project, situated in Songshan Lake, Dongguan, is advancing steadily. The company is tailoring its prototyping and validation processes to align precisely with customer requirements. By the close of 2026, Biwin Storage anticipates that the project's monthly production capacity will surge to 5,000 wafers, with a further escalation to 10,000 wafers by the end of 2027. Moreover, the company has set its sights on initiating revenue generation by the end of 2026. This project is poised to offer customers a comprehensive, one-stop solution encompassing 'storage + wafer-level advanced packaging and testing,' thereby bolstering Biwin Storage's competitive edge in the realm of memory-computing integration.
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