On this Thursday, Intel published an in - depth article that elaborates on the benefits of its EMIB (Embedded Multi - Die Interconnect Bridge) packaging technology. The article also draws a comparison between EMIB and the widely - used 2.5D packaging solutions prevalent in the industry.

The company stressed that EMIB outperforms in terms of cost - effectiveness, design complexity management, and system flexibility. This makes it an ideal candidate for facilitating the development of next - generation high - performance chips.

EMIB achieves this by integrating a compact silicon bridge into the packaging substrate. This setup allows for high - speed interconnection between chips, eliminating the need for a full - scale silicon interposer. As a result, it conserves silicon resources, cuts down on costs, and enhances production yield.

The flexible design of EMIB enables a “mix - and - match” strategy for integrating multiple chips, catering to a wide range of requirements. Moreover, EMIB technology has been in mass production for several years, demonstrating a high level of maturity and a reliable supply chain. These factors position it as a crucial advantage for Intel's foundry business in the fierce competition for high - end orders.