In January 2026, Beijing Xulun Technology Co., Ltd. revealed the successful closure of a strategic funding round, raising in excess of 100 million yuan. The investor lineup featured prominent names such as North Huachuang Venture Capital Fund and Novartis, among others. The capital injection will be earmarked for the second-phase capacity expansion of the UV Tape/DAF product line, bolstering research and development endeavors in semiconductor packaging materials, and enhancing service quality within the customer delivery framework. Xulun Technology stands as a specialist in the semiconductor packaging adhesive films and tapes sector, with its product range encompassing crucial processes like wafer thinning and chip attachment. The company has already extended mass production support to approximately a hundred front-running semiconductor firms, including industry giants BOE and ChangXin Memory Technologies.