For an extended period, the semiconductor industry has grappled with a fundamental paradox: while it is widely acknowledged that next-generation materials boast superior performance, the crux of the problem lies in their manufacturing process. Recently, a research team helmed by Academician Hao Yue and Professor Zhang Jincheng has achieved a significant breakthrough. By employing innovative technology, they have successfully transformed the "island-like" connections between materials into atomically smooth "thin films," dramatically boosting the chip's cooling efficiency and overall performance. This accomplishment not only breaks through a technical bottleneck that has persisted for nearly two decades but also showcases immense potential at the cutting edge of technology. The relevant research findings have been published in internationally renowned top-tier journals, including Nature Communications and Science Advances.