Recently, crucial details regarding Samsung's upcoming flagship mobile processor, the Exynos 2700, have come to light. The chip is slated for release in 2027 and bears the internal codename 'Ulysses'. Leveraging Samsung's second-generation 2nm process technology (SF2P), it promises a 12% boost in performance alongside a 25% reduction in power consumption. The CPU's high-performance core (super-large core) is anticipated to hit a clock speed of 4.2GHz, incorporating ARM's latest C2 core architecture, which brings about an approximate 35% enhancement in Instructions Per Cycle (IPC) performance. The Exynos 2700 will also feature an Xclipse GPU, built upon AMD's architecture, and will support LPDDR6 memory as well as UFS 5.0 flash storage. These integrations are expected to yield a 30% to 40% improvement in both graphics and storage performance. Moreover, the chip will employ FOWLP-SbS packaging technology and introduce a unified 'thermal pathway block' to optimize heat dissipation.