Search
WUS Printed Circuit (Kunshan) Co., Ltd.: Achieving Mastery in the Hybrid Lamination Technique for M9 High-Speed Materials
2 week ago /
Read about 0 minute
Author：小编
On January 11, 2026, WUS Printed Circuit (Kunshan) Co., Ltd. made an exciting announcement. The company has successfully mastered the hybrid lamination process for M9-grade high-speed materials. This breakthrough allows for seamless integration with conventional materials, perfectly catering to the stringent requirements for dielectric properties in high-speed signal transmission scenarios.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
