Two sources with insider knowledge have disclosed that Montage Technology, a prominent Chinese semiconductor design firm, is poised to undertake a secondary listing in Hong Kong this month. The company aims to raise an amount ranging from $800 million to $1 billion through this share offering. According to data from the London Stock Exchange Group, if Montage Technology successfully raises $1 billion, it will mark the largest new stock issuance in the Hong Kong market since Zijin Mining International's listing there in September of the previous year. This week, on Monday, Montage Technology cleared the listing hearing at the Hong Kong Stock Exchange. Although the exact listing timeline hasn't been firmly established yet, there's a strong likelihood that the company will go public on January 26. Established in 2004, Montage Technology is a specialist in fabless integrated circuit design. Its products are mainly utilized to boost data transmission speeds between chips in servers and data centers. The company made its debut on NASDAQ in 2013, went private a year after that, and then got relisted on the STAR Market of the Shanghai Stock Exchange in 2019. Currently, it boasts a market capitalization of around $22 billion. Montage Technology intends to allocate the funds raised from this listing towards research and development investments in the interconnect chip sector. Additionally, the proceeds will be used for marketing initiatives and strategic investments.