On January 7th, industry insiders disclosed that Micron is set to ramp up its monthly HBM4 production capacity to 15,000 wafers by 2026. This will represent nearly 30% of its total monthly HBM production capacity, which is projected to reach around 55,000 wafers. This move underscores Micron's full-fledged entry into the next-generation AI memory market. In the past, Micron found itself at a competitive disadvantage in the HBM sector, primarily because its production scale was relatively smaller compared to its South Korean rivals. However, the current landscape is undergoing a transformation. During the earnings call in December 2025, Micron CEO Sanjay Mehrotra announced that the company would substantially boost HBM4 production starting from the second quarter of 2026. He also anticipated that the yield ramp-up speed for HBM4 would outpace that of its predecessor, HBM3E. Industry analysts have observed that Micron has already commenced investing in equipment and is expediting its efforts to expand production capacity.