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SK Hynix to Unveil Its Cutting-Edge 16-Layer HBM4 Chip at CES
2026-01-06 /
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Author：小编
On January 6, 2026, SK Hynix made an announcement stating that it is set to introduce its next-generation high-bandwidth memory (HBM) product, namely the 16-layer 48GB HBM4 chip, at the Consumer Electronics Show (CES). In the realm of HBM technology, this chip stands out as one of those with the globally highest number of stack layers. It has been meticulously engineered to cater to the ever-increasing need for higher bandwidth and greater storage capacity in the fields of artificial intelligence (AI) and data centers. Moreover, SK Hynix will also be showcasing the 12-layer 36GB HBM3E product. Additionally, AI server GPU modules from global customers that incorporate this product will also be on display.
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