This year, TSMC is set to embark on a substantial expansion of its advanced process production capacity. By the end of this year, the monthly production capacity for 2-nanometer processes is projected to soar from the current range of 40,000 to 50,000 wafers to a staggering 90,000 to 100,000 wafers by 2026, marking a more than twofold increase. Meanwhile, the monthly production capacity for 3-nanometer processes is also expected to climb, rising from 110,000 to 120,000 wafers in 2025 to 160,000 to 170,000 wafers in 2026, representing an approximate 30% jump. This strategic move is poised to trigger a significant uptick in the consumption of key materials essential for advanced processes.
