In December 2025, news emerged that Samsung has set its sights on elevating its monthly HBM production capacity by around 50% by the close of 2026. The envisioned goal is to reach a monthly capacity of 250,000 wafers (calculated on the basis of 12 - inch wafers), which marks an almost 50% jump.

This capacity - expansion initiative is centered on HBM4 products. Samsung plans to accomplish this by reallocating its existing DRAM production capacity and constructing new production lines at the Pyeongtaek P4 wafer plant.

It's worth noting that Samsung's initial foray into HBM3 and HBM3E didn't yield impressive results, causing its market share to take a hit. Nevertheless, in the latter half of 2025, Samsung's HBM3E and HBM4 samples underwent testing at customer sites, including that of NVIDIA, and delivered stellar performances. As a result, Samsung secured orders for 2026, which in turn has spurred this production - capacity expansion drive.