Intel Foundry, a division under Intel Corporation, is rapidly expanding its production capacity in the United States. Its Fab 52 facility, located in Chandler, Arizona, has now eclipsed TSMC's local wafer manufacturing campus in terms of both production capacity and plant scale. During an on-site inspection by a CNBC reporter, it was observed that Fab 52 has installed four ASML Twinscan NXE series Low-NA EUV lithography machines. This includes at least one cutting-edge NXE:3800E system, capable of processing 220 wafers hourly, and three NXE:3600D systems, each with a processing speed of 160 wafers per hour. The factory's master plan envisions accommodating at least 15 EUV lithography machines, with designated space allocated for potential upgrades to High-NA equipment.

Fab 52 is primarily dedicated to the 18A (1.8nm and below) process, boasting an anticipated monthly production capacity exceeding 40,000 wafers. This output is double that of TSMC's Fab 21 Phase I single module, which produces approximately 20,000 wafers monthly. Even if TSMC's Phase II incorporates N3 process capabilities, Intel is poised to sustain or equal its lead in both process generations and overall throughput. Presently, Fab 52 is in the initial production phase of the Panther Lake processor, leveraging the still-evolving 18A technology. Intel projects that the process yield will achieve world-class standards by early 2027. Prior to this milestone, to manage costs and mitigate risks, the factory will not operate at full capacity, and some high-end production capabilities will be temporarily sidelined.