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TSMC Steps Up U.S. Expansion: Arizona’s Second Facility Slated for 3nm Chip Production by 2027
2025-12-18 /
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Author：小编
TSMC is ramping up its efforts in cutting-edge chip fabrication within the United States. Japanese media sources indicate that TSMC intends to begin installing equipment at its second semiconductor fabrication plant in Arizona during the third quarter of 2026. The company aims to achieve volume production of 3nm chips by 2027, a full year earlier than initially planned. Furthermore, site preparation for the third semiconductor fabrication plant, which will employ a 2nm process, has already been contracted out, with construction slated to kick off in the second quarter of 2026.
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