Apple is intensifying its pursuit of 'vertical integration,' speeding up the creation of its inaugural in - house AI server chip, internally codenamed 'Baltra.' In this endeavor, Broadcom has been selected as a pivotal collaborator. The anticipated deployment date for this chip is 2027, with the primary objective of diminishing Apple's dependence on Nvidia's chips.

'Baltra' is tailored specifically for AI inference tasks. Its architectural design sets it apart from conventional training chips, as it places a strong emphasis on achieving low latency and high concurrent throughput. To ensure optimal performance in these areas, Apple and Broadcom will work hand - in - hand to fine - tune its capabilities in low - precision mathematical computations.

In terms of manufacturing, the chip is likely to leverage TSMC's advanced 3nm 'N3E' process. Design work on the chip is projected to reach completion within the next 12 months.

Moreover, Apple is broadening its range of self - developed chips. The company is actively engaged in the development of various components, including the 5G baseband chip C1 and the Wi - Fi and Bluetooth chip N1. There are also whispers in the industry that Apple's upcoming AI glasses will be equipped with a variant of the Apple Watch S - series chip.