According to two industry insiders, chip giant Intel conducted tests this year on chip - manufacturing equipment sourced from a U.S. - based company of a Chinese equipment supplier, along with its two affiliated subsidiaries. The equipment in question consisted of two wet - etching machines, which are specifically designed for the removal of materials from silicon wafers. At present, Intel is in the process of evaluating whether these machines are suitable for integration into its cutting - edge 14A chip - manufacturing process. This highly advanced process is slated to commence initial production in 2027.
