Samsung Foundry has unveiled a cutting - edge packaging technology named 'Heat Pass Block' (HPB), with plans to first implement it on the Exynos 2600 chip. In this innovative approach, the DRAM is repositioned to the side of the chip during the packaging process. Meanwhile, a copper - based HPB heat sink is placed on top of the Application Processor (AP), enabling direct physical contact between the heat sink and the processor core. When compared to the previous generation of technology, this new method can effectively lower the average operating temperature of the chip by a remarkable 30%. Samsung has ambitions to extend the availability of this technology to major clients like Apple and Qualcomm. The underlying goal is to capitalize on its technological edge, attract more orders from these companies, and ultimately reshape the competitive landscape of the foundry market. Some industry evaluations have highlighted that Qualcomm's fifth - generation Snapdragon 8 Elite chip suffers from excessive power consumption. This 'overheating' problem presents Samsung with a golden opportunity to enter the market and gain a competitive foothold.