According to the research report from CITIC Construction Investment, the burgeoning demand for orthogonal backplanes and the advancement of the Cowop process are poised to steer the future development trajectory of PCBs (Printed Circuit Boards) towards the semiconductor realm. Consequently, their value is anticipated to witness a steady ascent. Firms such as Amazon, which lack the in-house chip design prowess of NVIDIA, are placing more stringent demands on materials like PCBs, thereby enhancing their value elasticity.

The escalating need for short-distance data transmission has spurred upgrades in PCBs and their upstream industrial chain components. Specifically, copper-clad laminates are undergoing a transition from M6 and M7 grades to M8 and M9, reflecting technological advancements and market demands. Furthermore, the expanding global market share of domestic PCB manufacturers is expected to catalyze the localization of the upstream industrial chain. This, in turn, will contribute to a broader domestic market presence for copper-clad laminates and high-end resins, fostering a more self-reliant and competitive industry landscape.