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Guofeng New Material: Polyimide Film Finds Applications in Diverse Sectors, Including Chip Flexible Packaging and Aerospace
2 week ago /
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Author：小编
On December 10, news emerged that Guofeng New Material, via an interactive platform, revealed the extensive application scope of its polyimide film materials. These materials span across a multitude of fields, encompassing flexible displays, integrated circuits, chip flexible packaging, 5G communications, new energy vehicles, electrical and electronic devices, as well as the aerospace industry. Among the company's current leading products are polyimide yellow base films of varying thickness specifications tailored for FPC (Flexible Printed Circuit), polyimide black films designed for shielding purposes, and polyimide carbon-based films.
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