The automotive sector is hurtling towards a brand-new epoch marked by intelligent cockpits, electric propulsion, and full self-driving capabilities. Yet, this march forward is up against a fundamental hurdle: devising chips that can offer top-notch performance and enhanced dependability over the entire lifespan of a vehicle. Additionally, automotive chips are under the gun to comply with ever-more rigorous functional safety norms and industry regulations, given that any malfunction could trigger recalls or even endanger road safety. To tackle these obstacles and stay competitive in a market that's evolving at breakneck speed, automakers and chip architects are pivoting towards multi-chip packaging technology. This setup doesn't just revolutionize the technological trajectory of automotive electronics; it also ushers in a host of fresh technical and commercial hurdles that call for immediate attention and resolution.