The "Multiple Strategies to Advance Xiamen's Integrated Circuit Industry (Draft for Public Comment)" is currently available for public review and feedback. According to the proposed measures, companies involved in the research and development (R&D) of core equipment essential for integrated circuit manufacturing, packaging, and testing processes will be eligible for subsidies. These subsidies will cover up to 30% of their R&D expenditures on core equipment, with an annual cap set at RMB 10 million.

Furthermore, the measures emphasize support for breakthroughs in key materials. Enterprises engaged in R&D for these critical materials will receive subsidies amounting to up to 30% of their R&D costs in this area, with an annual maximum subsidy of RMB 5 million.

Additionally, firms that achieve R&D milestones in the manufacturing of high-performance chips will also benefit from subsidies. These subsidies will cover up to 30% of their relevant R&D expenses, with the annual subsidy limit also set at RMB 5 million.